4月15日,自研市场有消息传出,应成小米日前内部宣布,立芯请以你的名字呼唤我在手机部产品部组织架构下成立芯片平台部,片平任命秦牧云担任芯片平台部负责人,台部向产品部总经理李俊汇报。自研
资料显示,应成秦牧云此前曾在高通任职,立芯担任高通产品市场高级总监,片平请以你的名字呼唤我后加入小米。台部
但在当天傍晚,自研小米集团公关部总经理王化发文回应关于成立芯片平台部相关消息,应成表示小米集团的立芯手机产品部的芯片平台部一直存在,主要负责收集产品芯片平台选型评估和深度定制,片平而秦牧云也加入小米已久。台部
2
8
2025-04-17 00:00:00
96752
23953
2025-04-17 00:00:00
11
32824
2025-04-17 00:00:00
34
7
2025-04-17 00:00:00
85
1996
2025-04-17 00:00:00
49767
485
2025-04-17 00:00:00
1
6757
2025-04-17 00:00:00
6
6852
2025-04-17 00:00:00
4212
61
2025-04-17 00:00:00
5875
15317
2025-04-17 00:00:00
123
855
2025-04-17 00:00:00
46872
57499
2025-04-17 00:00:00
95765
9293
2025-04-17 00:00:00
75345
73148
2025-04-17 00:00:00
8256
39331
2025-04-17 00:00:00
79
51812
2025-04-17 00:00:00
68
47336
2025-04-17 00:00:00
6421
61423
2025-04-17 00:00:00
5531
44643
2025-04-17 00:00:00
125
461
2025-04-17 00:00:00
6
24
2025-04-17 00:00:00
856
8
2025-04-17 00:00:00
97422
833
2025-04-17 00:00:00
3
1284
2025-04-17 00:00:00
73
471
2025-04-17 00:00:00
836
25814
2025-04-17 00:00:00
44
7
2025-04-17 00:00:00
75
92
2025-04-17 00:00:00
454
33564
2025-04-17 00:00:00
5
1819
2025-04-17 00:00:00
38
94718
2025-04-17 00:00:00
7266
159
2025-04-17 00:00:00
387
85
2025-04-17 00:00:00
7
85
2025-04-17 00:00:00
3585
2425
2025-04-17 00:00:00
1178
6
2025-04-17 00:00:00
465
2
2025-04-17 00:00:00
9748
342
2025-04-17 00:00:00
93
87
2025-04-17 00:00:00
671
3128
2025-04-17 00:00:00
951
5
2025-04-17 00:00:00
3992
8
2025-04-17 00:00:00
51
56
2025-04-17 00:00:00
1
31
2025-04-17 00:00:00
1656
3
2025-04-17 00:00:00
65
62495
2025-04-17 00:00:00
163
7135
2025-04-17 00:00:00
7
18
2025-04-17 00:00:00
9
52568
2025-04-17 00:00:00
9919
5
2025-04-17 00:00:00
234
91936
2025-04-17 00:00:00
38
925
2025-04-17 00:00:00
822
3
2025-04-17 00:00:00
493
617
2025-04-17 00:00:00
1234
3
2025-04-17 00:00:00
7
36
2025-04-17 00:00:00
8526
8
2025-04-17 00:00:00
69
1
2025-04-17 00:00:00
2852
141
2025-04-17 00:00:00
45
13239
2025-04-17 00:00:00
1618
466
2025-04-17 00:00:00
9638
542
2025-04-17 00:00:00